Description
Description
SoFix S-BGN2 Mini BGA Heating Station For Laptop Macbook Pro Motherboard Heating Soldering T2 Chip Glue Removal Fix Repair Tool
Usefulness:
1. S-BGN2 is used to fix the motherboard and provide welding heating function for the motherboard
2. It can be used to replace large and small CPU, Graphics card, PCH, Upgrade memory/SSD, Remove T2 chip, etc.
3. Supports BGA chip disassembly and assembly of MacBook, iPad logic board, Windows notebooks, tablets, etc.
4. Auxiliary heating/Removal of high-temperature solder, Replacement of BGA processors, Fixing motherboard/Convenient removal of
black glue BGA chip
Function details:
1. Four function control buttons are set on the host
(1) Baking Board: Used for baking motherboard, Auxiliary heating (Cleaning high-temperature tin from solder pads), Removing RAM/T2
chips, etc.
(2) CPU/GPU: Used for soldering large CPU processors (Such as Inter CPU, M1 Pro/Max, M2 Pro/Max, etc.), GPU (Graphics chip)
(3) Small CPU/PCH: Used for soldering small CPU processors (Such as A1932/A2179, M1, M2, M3, etc.), PCH (Platform Controller Hub)
(4) Pause/Return: Pause (Stop/Start key), Return (Long press to return to the home page)
2. Introduction to each interface
1) ON/OFF: Switch key (Controls the main power input on and off)
2) AC~INPUT (110V-220V): AC power input, Supports 110V and 220V specifications
3) 30:00: 30-minute power protection. When the host works for 30 minutes in the same time period, the power will be automatically
cut off. It plays a protective role in long-term heating
4) RESET: The button controls the working status of the host. After pressing the “RESET” button, the host will return to the
working state and the working time will return to 30 minutes
3. Introduction to usage
1) Preheating: Indicates that the motherboard is preheating. When the progress bar reach 50%, you can use tweezers to remove the
white glue around the chip.
2) Heating: Indicates that the heater is heating up.
3) Soldering: When the heating progress bar reach 100%, Preheating changes to Soldering, indicating that the motherboard has
reached the soldering state.
4) In the Soldering state, the buzzer will sound. At this time, you can use air gun to assist in heating. After about one minute,
remove the BGA chip
Usefulness:
1. S-BGN2 is used to fix the motherboard and provide welding heating function for the motherboard
2. It can be used to replace large and small CPU, Graphics card, PCH, Upgrade memory/SSD, Remove T2 chip, etc.
3. Supports BGA chip disassembly and assembly of MacBook, iPad logic board, Windows notebooks, tablets, etc.
4. Auxiliary heating/Removal of high-temperature solder, Replacement of BGA processors, Fixing motherboard/Convenient removal of
black glue BGA chip
Function details:
1. Four function control buttons are set on the host
(1) Baking Board: Used for baking motherboard, Auxiliary heating (Cleaning high-temperature tin from solder pads), Removing RAM/T2
chips, etc.
(2) CPU/GPU: Used for soldering large CPU processors (Such as Inter CPU, M1 Pro/Max, M2 Pro/Max, etc.), GPU (Graphics chip)
(3) Small CPU/PCH: Used for soldering small CPU processors (Such as A1932/A2179, M1, M2, M3, etc.), PCH (Platform Controller Hub)
(4) Pause/Return: Pause (Stop/Start key), Return (Long press to return to the home page)
2. Introduction to each interface
1) ON/OFF: Switch key (Controls the main power input on and off)
2) AC~INPUT (110V-220V): AC power input, Supports 110V and 220V specifications
3) 30:00: 30-minute power protection. When the host works for 30 minutes in the same time period, the power will be automatically
cut off. It plays a protective role in long-term heating
4) RESET: The button controls the working status of the host. After pressing the “RESET” button, the host will return to the
working state and the working time will return to 30 minutes
3. Introduction to usage
1) Preheating: Indicates that the motherboard is preheating. When the progress bar reach 50%, you can use tweezers to remove the
white glue around the chip.
2) Heating: Indicates that the heater is heating up.
3) Soldering: When the heating progress bar reach 100%, Preheating changes to Soldering, indicating that the motherboard has
reached the soldering state.
4) In the Soldering state, the buzzer will sound. At this time, you can use air gun to assist in heating. After about one minute,
remove the BGA chip
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