Description
Description
It is suitable for SMD repair paste such as mobile phone PCB, BGA and PGA. It is used in low ionic activator systems, with fast tin wetting speed, low smoke level, and high surface insulation resistance value after residue curing. Therefore, the electrical interference to communication products such as mobile phones is small.
HF-559 is a no-clean type solder paste with a very light residue color and a very high SIR value, which is recommended for ball array solder joint repair and ball repair such as BGA and cSP.
HF-559 is a no-clean type solder paste with a very light residue color and a very high SIR value, which is recommended for ball array solder joint repair and ball repair such as BGA and cSP.
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